| ID-One COSMO X (Codes SAAAAR : 093363 + patch 099E71;093364 + patchs 099441 et 099E21;093366) (ANSSI-CC-2023/06-R01 ) | Idemia | 2024-12-18 |
| Plateforme ID-One Cosmo V9.1 masquée sur le composant IFX SLC32 (Identification du matériel 092915) ( ANSSI-CC-2020/07-R01) | Idemia | 2025-05-09 |
| Huawei BaseBIOS 2.0 | Huawei Technologies Co., Ltd. | 2023-01-24 |
| CombICAO v3.1 on Cosmo X² (SSCD Configuration),Applet Code Versions : ’20 38 21 FF’ ; Applet Internal Version : ’01 03 04 11’ (EUCC-3090-2026-01) | IN SMART IDENTITY FRANCE | 2026-02-18 |
| S3K250A/S3K232A/S3K212A (S3K250A_20231028) (ANSSI-CC-2024/17) | Samsung Electronics Co. Ltd., | 2024-05-27 |
| MIFARE® DESFire® EV3 on ST31N600A02 (version 1.0.2) (ANSSI-CC-2024/25) | THALES DIS FRANCE SA | 2024-07-22 |
| ST33G1M2 C01 including optional cryptographic library NesLib and optional technology MIFARE4Mobile | STMicroelectronics | 2020-05-14 |
| ID-One COSMO X (R3 : 093363 ; R4 : 093364 ; R4 patché : 093364 + patch 099441) | Idemia | 2023-04-17 |
| ST33G1M2 D01 | STMicroelectronics | 2020-10-09 |
| CENTAURUS_FB_04 (CENTAURUS_v3) | THALES DIS FRANCE SA | 2023-06-21 |
| CombICAO Applet v2.1 in EAC with PACE configuration for French ID on ID-One Cosmo V9.2 (code SAAAAR : 203523) | Idemia | 2020-07-27 |
| STMicroelectronics STSafe VJ200 v1.4.1 | STMicroelectronics S.r.l et STMicroelectronics | 2024-09-17 |
| P73N2M0B0.2C2/2C6 (B0.2C2 / B0.2C6) (ANSSI-CC-2019/62-R01) | NXP Semiconductors | 2024-06-14 |
| ST33J2M0 A02 | STMicroelectronics | 2017-08-21 |
| CombICAO Applet v3 on ID-One Cosmo X (EAC with PACE for French ID configuration(SAAAAR : 203742) | Idemia / Infineon Technologies AG | 2023-06-21 |
| NXP JCOP 5.2 on SN100.C58 Secure Element | NXP Semiconductors Germany GmbH | 2023-04-19 |
| ID-One ePass IDL Full EACv2 in PACE MRTD configuration on Infineon SLE77CLFX2400P and SLE77CLFX2407P | Oberthur Card Systems | 2017-05-11 |
| Cryptographic library NESLIB 6.11.3 on ST31R480 B01 (version 6.11.3) (ANSSI-CC-2025/27) | STMicroelectronics | 2025-07-10 |
| ChipDoc v4 on JCOP 4.5 P71 in SSCD configuration(Version 4.0.1.52) | NXP Semiconductors | 2023-03-01 |
| MTCOS Pro 2.6 QSCD/SSCD / SLC37 (V11) | MaskTech International GmbH | 2024-11-13 |
| Infineon Security Controller IFX_CCI_000003h, 000005h, 000008h, 00000Ch, 000013h, 000014h, 000015h, 00001Ch, 00001Dh, 000021h, 00022h in the design step H13 | Infineon Technologies AG | 2025-08-05 |
| NCJ38AC High-performance secure microcontroller with Crypto Library for Automotive(B0.2C8/B0.2CB/B0.2CC) ( ANSSI-CC-2019/23-R01) | NXP Semiconductors | 2024-04-17 |
| IAS ECC v2, version 1.3, in configuration #4 on ID-One Cosmo v8.2 open platform on NXP P6022M VBIdentification de l’application : F0 02 02 13 (ANSSI-CC-2020/53-R01) | Idemia | 2023-11-10 |
| IAS Classic V4.4.2 on MultiApp V4.1 Version IAS 4.4.2.A version 2 (ANSSI-CC-2025/54) | THALES DIS FRANCE SA | 2026-01-20 |
| Qualcomm Secure Processor Unit SPU300 (Version: 9.0) in SM8850 SoC (Qualcomm® Snapdragon™ 8 Gen 5) with symmetric and asymmetric crypto support | Qualcomm Technologies Inc. | 2026-01-09 |
| Infineon Technologies AG Secure Signature Creation Device with Key Import (SSCD) configuration of SECORA™ ID v2.01 Infineon Applet Collection - eSign V1.0 | Infineon Technologies AG | 2025-07-21 |
| IAS ECC V2 en configuration #2 en composition sur la plateforme ouverte ID-One Cosmo v8.1-N – Large R2 masquée sur le composant NXP P6022M VB | Idemia | 2018-05-04 |
| Shenzhen Goodix GEOP01 on GSEA01 Security Chip version 1.0 | Shenzhen Goodix Technology Co., Ltd. | 2023-05-20 |
| NXP JCOP 6.2 on SN220 Secure Element, R1.01.1, R1.02.1, R1.02.1-1, R2.01.1 | NXP Semiconductors Germany GmbH | 2022-11-29 |
| ST33G1M2A1 including optional cryptographic library NesLib and optional library SFM(C05) (ANSSI-CC-2020/24-R02) | STMicroelectronics | 2025-08-12 |
| CombICAO Applet v2.1 in EAC configuration on ID-One Cosmo V9.2 (code SAAAAR : 203523) | Idemia | 2020-07-27 |
| Plateforme ID-One Cosmo v8.2 masquée sur le composant NXP P60D145 Codes SAAAAR : 091121, 094223 et 094742 (ANSSI-CC-2020/26-R01) | Idemia | 2023-11-13 |
| CombICAO v3.1 on Cosmo X² (EAC Configuration),Applet Code Versions : ’20 38 21 FF’ ; Applet Internal Version : ’01 03 04 11’ (EUCC-3090-2026-03) | IN SMART IDENTITY FRANCE | 2026-02-18 |
| S3SSE2A (S3SSE2A_20250522)(ANSSI-CC-2024/26-R01) | Samsung Electronics Co. Ltd., | 2025-10-01 |
| Trusted Security Filter (TSF) 401 | Thales Norway AS | 2025-12-16 |
| NesLib 6.7.4 on ST33K1M5C and ST33K1M5T C02 | STMicroelectronics | 2024-11-14 |
| NXP JCOP 7.x on SN300 Secure Element, versions JCOP 7.0 R1.62.0.1, JCOP 7.1 R1.04.0.1, JCOP 7.2 R1.09.0.1, JCOP 7.3 R1.07.0.1 | NXP Semiconductors Netherlands N.V. | 2026-03-05 |
| Cryptographic library NESLIB 6.7.4 on ST31N600 A03 (version 6.7.4) (ANSSI-CC-2022/42-R02) | STMicroelectronics | 2025-06-04 |
| CombICAO Applet v3 on ID-One Cosmo X (SSCD Configuration) SAAAAR : 203742 (ANSSI-CC-2023/51) | Idemia / Infineon Technologies AG | 2023-11-17 |
| IAS Classic v5.2.3 with MOC Server v3.1.1 on MultiApp V5.2 Versions 5.2.3.A.C et 5.2.3.A.O (ANSSI-CC-2025/40) | THALES DIS FRANCE SA | 2025-12-15 |
| S3K170A/S3K140A (Référence S3K170A_20221028) | Samsung Electronics Co. Ltd., | 2023-01-20 |
| TMCOS 4.0 0.3 on THD89 1.0.3 Secure Element Java Card System Platform, version v4.0 0.3 | Beijing TsingTeng MicroSystem Co.,Ltd. | 2025-01-24 |
| SpiFlash TrustME Secure Flash Memory W75F40W[W/R][I/J/W][B/C] & W75F40W[BY/Q3][I/J/W][C/B]G version AA | Winbond Electronics Corporation | 2025-05-20 |
| ST31P450 A02 | STMicroelectronics | 2020-02-18 |
| IDmove v5 on SCR404U in PACE configuration with AA and/or CA in optionOS Commercial Version : 0x098912 ; OS Unique Identifier : 0xB7BC0108 et E48C0108 (ANSSI-CC-2023/66) | Idemia | 2024-01-19 |
| eTravel 2.4 en configuration EAC SAC sur plateforme ID Motion V2 (Version de l’application eTravel : 2.4) (ANSSI-CC-2018/38v2-R01) | THALES DIS FRANCE SA | 2025-02-12 |
| ID-A v1.0 on ID-One Cosmo J (SAAAAR : 417701, 418402 et 417652) | Idemia | 2021-11-23 |
| ST33G1M2A and ST33G1M2M including optional cryptographic library NesLib(C04) (ANSSI-CC-2020/23-R02) | STMicroelectronics | 2025-08-12 |
| Microcontroller CENTAURUS_FB_04 | INVIA Secure Semiconductor | 2019-11-29 |
| Infineon Technologies AG ePassport configuration of SECORA™ ID v2.01 Infineon Applet Collection - eMRTD V2.0 | Infineon Technologies AG | 2025-04-10 |
| IDmove v5 on SCR404U in EAC with PACE configuration and LDSv2, AA in optionOS Commercial Version : 0x098912 ; OS Unique Identifier : 0xB7BC0108 et E48C0108 ( ANSSI-CC-2023/65) | Idemia | 2024-01-19 |
| MultiApp v4.0.1 with Filter Set 1.0 Java Card Open Platform on M7892 G12 chip(MultiApp v4.0.1 with Filter Set 1.0) (ANSSI-CC-2020/42-R01) | THALES DIS FRANCE SA | 2025-01-08 |
| Plateforme Java Card MultiApp GP-SE (version 5.0) | THALES DIS FRANCE SA | 2022-06-07 |
| SDoT Software Data Diode, SDoT SDD 1.3i | INFODAS GmbH | 2024-12-05 |
| S3K250A/S3K232A/S3K212A (S3K250A_20241028) (ANSSI-CC-2024/17-R01) | Samsung Electronics Co. Ltd., | 2025-01-24 |
| S3K250A/S3K232A/S3K212A Référence S3K250A_20221028 | Samsung Electronics Co. Ltd., | 2023-01-20 |
| NXP SE310 Series - Secure Element version SE310_SE A0.1.000 J2 | NXP Semiconductors Germany GmbH | 2024-11-19 |
| Infineon Technologies Security Controller M7794 A12 and G12 with specific IC-dedicated firmware identifier V77.017.12.0 or V77.017.12.2 or V77.017.13.2 | Infineon Technologies AG | 2021-07-07 |
| CombICAO Applet v3 on ID-One Cosmo X (EAC Configuration) SAAAAR : 203742 (ANSSI-CC-2023/48) | Idemia / Infineon Technologies AG | 2023-11-17 |
| Samsung STRONGV4P00 of S5E9945 with Specific IC Dedicated Software, Revision 1.2 | Samsung Electronics Co. Ltd., | 2024-11-28 |
| ID-One ePass IDL Full EACv2 in EAC with PACE MRTD configuration on Infineon SLE77CLFX2400P and SLE77CLFX2407P | Oberthur Card Systems | 2017-05-11 |
| ST33G1M2 (D02) (ANSSI-CC-2020/78-R01) | STMicroelectronics | 2024-02-27 |
| eTravel Essential 1.1 (EACv1 and AA activated) | THALES DIS FRANCE SA | 2022-01-24 |
| Digital Identity on MultiApp v4.0.1 platform with Filter Set 1.0 - PACE, EAC(version 1.0) | THALES DIS FRANCE SA | 2025-01-08 |
| NXP JCOP 5.1 on SN100.C48 Secure Element | NXP Semiconductors Germany GmbH | 2023-04-19 |
| eTravel v2.2 EAC/BAC on MultiApp v4.0.1 platform with Filter Set 1.0 (version 1.0) (ANSSI-CC-2020/44-R01) | THALES DIS FRANCE SA | 2025-01-10 |
| KCOS e-Passport Version 5.1 - SAC, EAC and AA on S3D384E | KOMSCO | 2025-09-30 |
| S3B512C/SC3512 , S3B512C_20250601 (EUCC-3090-2026-21) | Samsung Electronics Co. Ltd., | 2026-03-18 |
| PR/SM for IBM z17 and IBM LinuxONE 5 Systems, Driver Level D61C with Bundle Level H10/S10 | IBM Corporation | 2026-01-28 |
| S3FT9PF/S3FT9PT/S3FT9PS (S3FT9PF_20210329) | Samsung Electronics Co. Ltd., | 2021-04-26 |
| Microcontrôleur ORION_CB_03 | INVIA Secure Semiconductor | 2017-07-26 |
| ArcaShield Platform(Version 0003040E) (ANSSI-CC-2025/38) | Samsung Electronics Co. Ltd., | 2025-10-14 |
| ST33G1M2A and ST33G1M2M C01 including optional cryptographic library NesLib | STMicroelectronics | 2020-05-14 |
| ST33G1M2A1 C01 including optional cryptographic library NesLib and optional library SFM | STMicroelectronics | 2020-05-14 |
| eTravel 3.2 EAC on SAC on MultiApp V5.2 version 3.2.1.0 (ANSSI-CC-2025/45) | THALES DIS FRANCE SA | 2025-12-16 |
| ST54J / ST54K , A08 (EUCC-3090-2026-06) | STMicroelectronics | 2026-02-16 |
| NXP SmartePP Enhanced/Next-gen on P71 version 03 00 00 10 | NXP Semiconductors Germany GmbH | 2021-05-12 |
| Plateforme JavaCard MultiApp V4.0 en configuration ouverte basée sur l’Operating System JLEP3 masquée sur le composant SLE78CLFX4000PH (M7892 G12) | Gemalto | 2017-03-08 |
| ORION_CB_03/ORION_DB_03 (ORION_v3) ( ANSSI-CC-2017/41-R01) | THALES DIS FRANCE SA | 2023-06-21 |
| IDEMIA TnD v5.1 on ID-One Cosmo X (PACE/EAC1/Polymorphic eMRTD/LDS2 configuration) | Idemia | 2023-11-23 |
| CombICAO Applet v3 on ID-One Cosmo X (SSCD Configuration) SAAAAR : 203742 | Idemia | 2023-05-05 |
| ST31P450(A08) (EUCC-3090-2025-11-08) | STMicroelectronics | 2025-12-10 |
| Samsung S3FT9FA 16-bit RISC Microcontroller for Smart Card (S3FT9FA_20240430) (ANSSI-CC-2024/08) | Samsung Electronics Co. Ltd., | 2024-05-16 |
| NXP JCOP8.x on SE310 A0 Secure Element, JCOP 8.0 R1.38.0.1 | NXP Semiconductors | 2023-11-28 |
| ChipDoc v3.1 on JCOP 4 P71 in SSCD configuration (v2) | NXP Semiconductors | 2022-09-28 |
| MultiApp Essential v1.1 Platform with Full, Light, XLight_T1 and XLight_NB configurations | THALES DIS FRANCE SA | 2021-06-18 |
| ePassport configuration of SECORA™ ID S Infineon Applet - eMRTD V1.2 | Infineon Technologies AG | 2025-08-26 |
| ACOS-IDv4.1 SSCD (A) CB-Comm (version 4.1 SSCD (A)) (ANSSI-CC-2025/17) | Austria Card plastikkarten und Ausweissysteme Gmbh | 2025-03-30 |
| MIFARE DESFire EV3 on ST31R480 A01(version 1.0.3) (ANSSI-CC-2025/31) | STMicroelectronics | 2025-09-09 |
| S3K200B/S3K170B/S3K140B (S3K200B_20231028) (ANSSI-CC-2024/18) | Samsung Electronics Co. Ltd., | 2024-05-27 |
| Veridos Suite v4.0 – cryptovision ePasslet Suite – Java Card applet configuration providing Secure Signature Creation Device with Key import (SSCD) | Veridos GmbH - Identity Solutions by Giesecke & Devrient and Bundesdruckerei | 2024-01-12 |
| ACOS-IDv2.1 SSCD (C) CL-TC-Comm Version 2.1 SSCD (C) (ANSSI-CC-2025/51) | Austria Card plastikkarten und Ausweissysteme Gmbh | 2026-01-20 |
| ST31H320 C01 including optional cryptographic library NESLIB version 6.2.1 | STMicroelectronics | 2019-05-09 |
| IDmove v4 on Infineon in EAC with PACE configuration with AA in option OS Commercial Version : 0x 09 08 06 ; OS Unique Identifier : 0x DC 71 (ANSSI-CC-2019/57-R01) | Idemia / Infineon Technologies AG | 2023-07-18 |
| STMicroelectronics NesLib 6.7.4 on ST33K1M5A and ST33K1M5M B01 | STMicroelectronics | 2022-11-24 |
| NXP JCOP 7.x on SN300 Secure Element, versions JCOP 7.0 R1.62.0.1, JCOP 7.1 R1.04.0.1 and JCOP 7.2 R1.09.0.1 | NXP Semiconductors | 2024-10-21 |
| ST31P450 including optional cryptographic library NESLIB(C03) (EUCC-3090-2025-11-09) | STMicroelectronics | 2025-12-10 |
| ChipDoc v4.1 on JCOP 4.5 P71 in SSCD configurationVersion 4.1.1.52 (ANSSI-CC-2023/69v2) | NXP Semiconductors | 2026-02-16 |
| MaskTech eSign Applet on Secora ID S v1.1 | MaskTech International GmbH | 2022-10-18 |
| ST31P450 (A06) (ANSSI-CC-2020/04-R01) | STMicroelectronics | 2024-03-11 |
| NXP JCOP 4.x on P73N2M0B0.2C2/2C6 Secure Element | NXP Semiconductors Germany GmbH, Business Unit Security and Connectivity | 2022-12-02 |
| S3FV9RR/S3FV9RQ/S3FV9RP/S3FV9RK , ( S3FV9RR_20250607) (EUCC-3090-2026-08) | Samsung Electronics Co. Ltd., | 2026-03-18 |
| ST33J2M0 including optional cryptographic library NESLIB (F02) (ANSSI-CC-2024/06-R01) | STMicroelectronics | 2025-01-08 |
| MIFARE® Plus® EV2 on ST31R480 A01 (version 1.0.3) (ANSSI-CC-2025/33) | STMicroelectronics | 2025-09-29 |
| BelPIC V1.8 on MultiApp V5.0 Platform | THALES DIS FRANCE SA | 2022-11-29 |
| Infineon smartcard IC (Security Controller) M7791 B12 with specific IC-dedicated firmware | Infineon Technologies AG | 2021-12-21 |
| Infineon eID-OSv1.0 SSCD (A) CL-TC-Comm (version 1.0 SSCD (A)) (ANSSI-CC-2025/22) | Infineon Technologies AG | 2025-06-16 |
| CombICAO v3.1 on Cosmo X² (EAC with PACE for French ID Configuration) ,Applet Code Versions : ’20 38 21 FF’ ; Applet Internal Version : ’01 03 04 11’ | IN SMART IDENTITY FRANCE | 2026-02-18 |
| ST31G480 F01 including optional cryptographic library NESLIB (ANSSI-CC-2023/52) | STMicroelectronics | 2023-12-28 |
| S3K170A/S3K140A Référence S3K170A_20211028 | Samsung Electronics Co. Ltd., | 2022-01-24 |
| PikeOS Separation Kernel, Version 5.1.3 | SYSGO GmbH | 2022-09-20 |
| MS6001 embarquant la bibliothèque cryptographique Toolbox version 06.04.01.07 et la bibliothèque Wear Levelling version 06.03.02.02 (révision E) ( ANSSI-CC-2018/02-R01) | SEALSQ France | 2025-03-30 |
| Samsung STRONGV3P00_ln04lpe of S5E9935 with Specific IC Dedicated Software, Revision 0.0 | Samsung Electronics Co. Ltd., | 2023-12-06 |
| ST31G480 G01 including optional cryptographic library NESLIB (ANSSI-CC-2023/53) | STMicroelectronics | 2023-12-28 |
| S3K170A/S3K140A (S3K170A_20241028) (ANSSI-CC-2024/16-R01) | Samsung Electronics Co. Ltd., | 2025-01-24 |
| eTravel v2.2 EAC/SAC on MultiApp v4.0.1 platform with Filter Set 1.0 (version 1.0) (ANSSI-CC-2020/45-R01) | THALES DIS FRANCE SA | 2025-01-10 |
| S3FV9QM/S3FV9QK (S3FV9QM_20240504) (ANSSI-CC-2024/30) | Samsung Electronics Co. Ltd., | 2024-09-12 |
| HID Global S.p.A. HIDApp-eDoc suite eIDAS eSign Application Version 3_00 | HID Global S.p.A | 2023-09-09 |
| NXP SN300 B2 Series - Secure Element version SN300_SE B2.1.001 JB | NXP Semiconductors Germany GmbH | 2024-11-19 |
| Samsung SSP01 of S5E9830 with Specific IC Dedicated Software Revision 1.1 | Samsung Electronics Co. Ltd., | 2021-03-18 |
| S3K200B/S3K170B/S3K140B (S3K200B_20241028) (ANSSI-CC-2024/18-R01) | Samsung Electronics Co. Ltd., | 2025-01-24 |
| eTravel 3.0 EAC on SAC on MultiApp v4.2 (version 3.0.0) | THALES DIS FRANCE SA | 2021-09-23 |
| IAS Classic V4.4.2 with MOC Server 1.1 on MultiApp V4.1 version IAS : 4.4.2.A, version MOC Server : 1.1.1A (ANSSI-CC-2023/57 ) | THALES DIS FRANCE SA | 2024-02-09 |
| Megahunt Security Chip MH1701 with IC Dedicated Software, V03_01 | Megahunt Technologies inc | 2021-05-20 |
| STMicroelectronics NesLib 6.7.4 on ST33K1M5C and ST33K1M5T B01 | STMicroelectronics | 2022-11-24 |
| XSmart e-Passport V1.5 EAC with PACE on M7892 | LG CNS | 2021-12-23 |
| ID-A v1.0 on ID-One Cosmo X Codes SAAAAR : 417692, 417693 | Idemia / Infineon Technologies AG | 2023-06-21 |
| ST31G480 E01, including optional cryptographic library NesLib NESLIB and optional technologies MIFARE DESFire EV1 and MIFARE Plus X | STMicroelectronics | 2019-03-05 |
| ST33G1M2A and ST33G1M2M D01 | STMicroelectronics | 2021-02-18 |
| NXP IDentity Applet v4.0/QSCD on NXP JCOP 4.5 P71 | NXP Semiconductors Germany GmbH | 2026-02-13 |
| ST31P450 including optional cryptographic library NesLib (C01) (ANSSI-CC-2023/74) | STMicroelectronics | 2024-03-11 |
| ChipDoc v3.2 on JCOP 4 P71 in ICAO EAC(1&2) with PACE configurationVersion 3.2.0.52 (ANSSI-CC-2025/02v2) | NXP Semiconductors Germany GmbH | 2026-02-16 |
| ST33G1M2 including optional cryptographic library NesLib (E02) (ANSSI-CC-2023/70-R01) | STMicroelectronics | 2025-08-08 |
| Cryptographic library NESLIB 6.7.4 on ST31N600 A04 , Version 6.7.4 (EUCC-3090-2026-11) | STMicroelectronics | 2026-04-10 |
| MTCOS Pro 2.6 EAC with PACE / SLC37 (V11) | MaskTech International GmbH | 2024-11-13 |
| S3K200B/S3K170B/S3K140B (Référence S3K200B_20221112) | Samsung Electronics Co. Ltd., | 2023-01-20 |
| NXP JCOP on SN100.C25 Secure Element | NXP Semiconductors | 2024-10-17 |
| ST54J A01 | STMicroelectronics | 2019-04-18 |
| S3FT9FA (S3FT9FA_20220430) | Samsung Electronics Co. Ltd., | 2022-06-27 |
| NXP JCOP8.x on SE310 A0 Secure Element, versions JCOP 8.0 R1.38.0.1, JCOP 8.1 R1.06.0.1 | NXP Semiconductors | 2024-10-30 |
| THD89 1.0.3 Secure Element version 1.0 | Tongxin Microelectronics Co., Ltd. | 2023-09-26 |
| IAS ECC V2 en configuration #3 en composition sur la plateforme ouverte ID-One Cosmo v8.1-N – Large R2 masquée sur le composant NXP P6022M VB | Idemia | 2018-05-04 |
| SCE900U (Version A) (ANSSI-CC-2024/19) | Idemia | 2024-07-02 |
| ePass Applet on Sm@rtCafé® Expert 8.0 C2 v1.0 | Veridos GmbH - Identity Solutions by Giesecke & Devrient and Bundesdruckerei | 2023-12-12 |
| S3FT9FA (S3FT9FA_20210430) | Samsung Electronics Co. Ltd., | 2021-04-26 |
| IDmove v4 on Infineon in EAC configuration with AA in option OS Commercial Version : 0x 09 08 06 ; OS Unique Identifier : 0x DC 71 (ANSSI-CC-2019/56-R01) | Idemia / Infineon Technologies AG | 2023-07-18 |
| Trusted Security Filter (TSF) 201 | Thales Norway AS | 2026-02-10 |
| NXP JCOP 8.x on SN300 B2 Secure Element, versions JCOP 8.0 R1.38.0.1, JCOP 8.1 R1.06.0.1 | NXP Semiconductors Netherlands N.V. | 2024-10-30 |
| SCE900U (version A) (EUCC-3090-2025-10-03) | Idemia | 2025-10-15 |
| ST33H768 D01 | STMicroelectronics | 2021-02-18 |
| ST33G1M2A and ST33G1M2M (D03) (ANSSI-CC-2020/79-R02) | STMicroelectronics | 2025-08-12 |
| CombICAO Applet v2.1 in SSCD configuration on Cosmo v9.2 (code SAAAAR : 203523) | Idemia | 2020-07-27 |
| BELPIC V1.8 applet on MultiApp V4.1 (Révision 1.0) (ANSSI-CC-2019/31-R01) | THALES DIS FRANCE SA | 2024-03-11 |
| STMicroelectronics NesLib 6.7.4 on ST33K1M5A and ST33K1M5M B03 | STMicroelectronics | 2024-11-14 |
| ACOS-IDv2.1 SSCD (C) CB-Comm Version 2.1 SSCD (C) (ANSSI-CC-2025/50) | Austria Card plastikkarten und Ausweissysteme Gmbh | 2026-01-20 |
| SOMA-c007 Machine Readable Electronic Document SSCD Application version 4 | HID Global | 2023-09-15 |
| eTravel Essential 1.2 – PACE, EAC and AA activated (release ‘0300’) | THALES DIS FRANCE SA | 2022-12-12 |
| Plateforme MultiApp V5.0 GP-SEConfiguration 1 : 5.0.1 version 2a, configuration 2 : 5.0.1 version 2b (ANSSI-CC-2022/23-R01) | THALES DIS FRANCE SA | 2026-02-05 |
| eTravel 2.5.A EAC on SAC on MultiApp V5.0.A(version 2.5.A.0.0) | THALES DIS FRANCE SA | 2022-12-12 |
| TnD v5.1 on ID-One Cosmo X (EAC Configuration) | Idemia | 2021-08-26 |
| IBM RACF for z/OS Version 2 Release 4 | IBM Corporation | 2022-09-22 |
| Veridos Suite v4.0 – cryptovision ePasslet Suite – Java Card applet configuration providing Secure Signature Creation Device with Key generation (SSCD) | Veridos GmbH - Identity Solutions by Giesecke & Devrient and Bundesdruckerei | 2024-01-12 |
| IAS ECC v2, version 1.3, in configuration #3 on ID-One Cosmo v8.2 open platform on NXP P6022M VBIdentification de l’application : F0 02 02 13 (ANSSI-CC-2020/52-R01) | Idemia | 2023-11-10 |
| TnD v5.1 on Cosmo J in EAC with PACE Configuration | Idemia | 2021-04-22 |
| NXP IDentity Applet v4.0/PACE-EAC1 (eMRTD)/PACE-EAC2 (eIDAS) on NXP JCOP 4.5 P71 | NXP Semiconductors Germany GmbH | 2026-02-13 |
| THN31 Secure Element version 1.0.1 | Beijing TsingTeng MicroSystem Co.,Ltd. | 2026-01-18 |
| CombICAO Applet v2.1 in SSCD configuration on Cosmo v9.1 (code SAAAAR : 203523) | Idemia | 2020-07-27 |
| Security Enclave TESIC-04001R20 in SEQUANS communication SOC Monarch 2/N-SQN3401 Référence TESIC-04001R20-BL2.0-AL28-CL3.0.F | TIEMPO SAS | 2021-11-11 |
| IAS Classic V4.4.2 with MOC server v1.1 on MultiApp V4.0.1(IAS version 4.4.2.A / MOC Server 1.1.1A) (ANSSI-CC-2018/24-R01) | THALES DIS FRANCE SA | 2026-02-04 |
| Samsung STRONGV3P10 of S5AV920/S5AV820/S5AV720 with specific IC Dedicated Software, version 2.0, 2.1 and 2.2 | Samsung Electronics Co. Ltd., | 2025-07-29 |
| Cryptographic library NESLIB 6.7.4 on ST31P450 A04 | STMicroelectronics | 2022-12-23 |
| ST33J2M0 D01 with optional cryptographic library NESLIB, and optional technology MIFARE4Mobile | STMicroelectronics | 2020-07-09 |
| Plateforme JavaCard MultiApp V4.0.1 - PACE en configuration ouverte masquée sur le composant M7892 G12 | Gemalto | 2017-12-18 |
| MultiApp V4.2 ID version 4.2.1 | THALES DIS FRANCE SA | 2021-09-23 |
| STMicroelectronics STSafe S320 v2.2.1 | STMicroelectronics | 2023-11-13 |
| ChipDoc v2 on JCOP 3 P60 in SSCD configuration (v7b4_2) (ANSSI-CC-2023/38) | NXP Semiconductors | 2023-07-21 |
| IAS ECC v2, version 1.3, in configuration #1 on ID-One Cosmo v8.2 open platform on NXP P6022M VB (Identification de l’application : F0 02 02 13) (ANSSI-CC-2020/50-R01) | Idemia | 2023-11-10 |
| IAS ECC V2 en configuration #4 en composition sur la plateforme ouverte ID-One Cosmo v8.1-N – Large R2 masquée sur le composant NXP P6022M VB | Idemia | 2018-05-04 |
| Plateforme ID-One Cosmo V9.2 masquée sur le composant IFX SLC52 | Idemia | 2020-04-09 |
| BELPIC V1.8 applet On MultiApp V4.1 Platform Révision 1.0 version 2 (ANSSI-CC-2025/56) | THALES DIS FRANCE SA | 2026-02-02 |
| eTravel 2.4 en configuration EAC BAC sur plateforme ID Motion V2(Version de l’application eTravel : 2.4) ( ANSSI-CC-2018/37v2-R01) | THALES DIS FRANCE SA | 2025-02-12 |
| S3FT9FA (S3FT9FA_20230430) | Samsung Electronics Co. Ltd., | 2023-03-27 |
| TactiGuard VSI | Saab Danmark AS | 2026-02-06 |
| Idemia ID-A v1.1 on ID-One Cosmo X | Idemia | 2023-12-22 |
| MTCOS Pro 2.6 EAC with PACE / P71D352 (N7121) | MaskTech International GmbH | 2023-10-27 |
| Qualcomm Secure Processor Unit SPU280 (Version: 7.0) in SM8650 SoC (Qualcomm® Snapdragon™ 8 Gen 3) with symmetric and asymmetric crypto support | Qualcomm Technologies Inc. | 2024-04-16 |
| Operator Terminal Adapter (OTA) 6.2.7 | Thales Norway AS | 2024-05-31 |
| MaskTech ePP Applet on Secora ID S v1.1 | MaskTech International GmbH | 2022-10-18 |
| CombICAO Applet v2.1 in EAC with PACE configuration on ID-One Cosmo V9.2 (code SAAAAR : 203523) | Idemia | 2020-07-27 |
| NXP eDoc Suite v4.0 on JCOP4.5 71 - cryptovision ePasslet Suite - Java Card applet configuration providing Secure Signature Creation Device with key import (SSCD) | NXP Semiconductors Germany GmbH | 2023-08-09 |
| NXP MF1P(H)x2 | NXP Semiconductors | 2023-03-10 |
| SOMA-ck022 Travel Document, Version 1.0 | TOPPAN Security S.r.l. | 2025-06-13 |
| ChipDoc v3.1 on JCOP 4 P71 in ICAO EAC(1&2) with PACE configurationVersion 3.1.6.52 (ANSSI-CC-2021/19-R01v2) | NXP Semiconductors Germany GmbH | 2026-02-16 |
| Cryptographic library NESLIB 6.7.4 on ST31N600 A01 | STMicroelectronics | 2022-12-23 |
| IAS Classic v5.2 on MultiApp V5.0 (versions 5.2.0.A.C version 2 et 5.2.0.A.O version 2) (ANSSI-CC-2025/46) | THALES DIS FRANCE SA | 2025-12-01 |
| MultiApp v4.1 Javacard Platform(version 4.1.0.4) (ANSSI-CC-2025/53) | THALES DIS FRANCE SA | 2025-12-16 |
| NXP JCOP 3 P60 | NXP Semiconductors Germany GmbH, Business Unit Security and Connectivity | 2021-07-23 |
| Samsung STRONGV2P0 of S5E9840 with Specific IC Dedicated Software revision 1.1 | Samsung Electronics Co. Ltd., | 2022-03-19 |
| ST33J2M0 (C03) ( ANSSI-CC-2020/29-R01) | STMicroelectronics | 2024-03-11 |
| NCJ38A0 High-performance secure microcontroller for Automotive (B0.207/B0.20C) ( ANSSI-CC-2018/60-R01) | NXP Semiconductors | 2024-04-17 |
| Infineon eID-OSv1.0 SSCD (A) CB-Comm (version 1.0 SSCD (A)) (ANSSI-CC-2025/21) | Infineon Technologies AG | 2025-06-16 |
| Winbond SpiFlash TrustME Secure Flash Memory W75F40WBYJEG version A | Winbond Electronics Corporation | 2022-06-07 |
| ChipDoc v4 on JCOP 4.5 P71 in ICAO EAC (1&2) with PACE configurationVersion 4.0.1.52 (ANSSI-CC-2023/11-R01v2) | NXP Semiconductors Germany GmbH | 2026-02-16 |
| PR/SM for IBM z16 and IBM LinuxONE Emperor 4 Systems, Driver Level D51C with Bundle Level 4B | IBM Corporation | 2023-03-10 |
| Microcontroller ORION_CB_03 et ORION_DB_03 (ORION_TOE_v5) (ANSSI-CC-2017/41-R03) | THALES DIS FRANCE SA | 2025-12-01 |
| Produit IAS Classic v5.2.1 with MOC Server v3.1 on MultiApp V5.1 Version 5.2.1.A.C et 5.2.1.A.O ( ANSSI-CC-2023/42 ) | THALES DIS FRANCE SA | 2023-09-29 |
| IDmove v4 on Infineon in PACE configuration with AA and/or CA in option OS Commercial Version : 0x 09 08 06 ; OS Unique Identifier : 0x DC 71 (ANSSI-CC-2019/58-R01) | Idemia / Infineon Technologies AG | 2023-07-18 |
| STMicroelectronics NesLib 6.7.4 on ST33K1M5C and ST33K1M5T C01 | STMicroelectronics | 2023-12-18 |
| IAS ECC V2 en configuration #1 en composition sur la plateforme ouverte ID-One Cosmo v8.1-N – Large R2 masquée sur le composant NXP P6022M VB | Idemia | 2018-05-04 |
| ST33G1M2 including optional cryptographic library NesLib (E01) (ANSSI-CC-2023/70) | STMicroelectronics | 2024-03-11 |
| Infineon ePassport configuration of SECORA™ ID S Infineon Applet Collection - eMRTD V1.1 | Infineon Technologies AG | 2021-04-27 |
| ST54J / ST54K (A06) (ANSSI-CC-2019/20-R01) | STMicroelectronics | 2024-03-11 |
| ORION_CB_03/ORION_DB_03 (Référence : ORION_TOE_v4) ( ANSSI-CC-2017/41-R02) | THALES DIS FRANCE SA | 2024-07-22 |
| IAS ECC v2, version 1.3, in configuration #2 on ID-One Cosmo v8.2 open platform on NXP P6022M VBIdentification de l’application : F0 02 02 13 (ANSSI-CC-2020/51-R01) | Idemia | 2023-11-10 |
| ST33J2M0 C01 | STMicroelectronics | 2020-07-09 |
| KOMSCO JK31 V1.1 on M7892 | KOMSCO | 2021-07-29 |
| MultiApp v4 Platform Version 4.0 (ANSSI-CC-2017/07-R01) | THALES DIS FRANCE SA | 2025-12-16 |
| Shenzhen Goodix Security Chip GSEA01.x.D00 with IC Dedicated Software | Shenzhen Goodix Technology Co., Ltd. | 2022-02-24 |
| Digital Identity 1.0.A PACE, EAC on MultiApp V5.0.A(version 1.0.A) | THALES DIS FRANCE SA | 2022-12-12 |
| MultiApp V4.0.1 Platform (Version 4.0.1) (ANSSI-2017/76-R01) | THALES DIS FRANCE SA | 2025-12-16 |
| TnD v5.1 on ID-One Cosmo J V2 (PACE/EAC1/Polymorphic eMRTD/LDS2 configuration) | Idemia | 2022-12-07 |
| ChipDoc v3 on JCOP 4 P71 in ICAO EAC with PACE configuration (Version 3.0.0.52) (ANSSI-CC-2020/72-R01) | NXP Semiconductors Germany GmbH | 2025-02-12 |
| IAS Classic v5.2.1 on Open platform MultiApp V5.1Versions 5.2.0.A.C et 5.2.0.A.O (ANSSI-CC-2025/58) | THALES DIS FRANCE SA | 2026-02-05 |
| NXP eDoc Suite v3.5 on JCOP4 71 - cryptovision ePasslet Suite – Java Card applet configuration providing Secure Signature Creation Device with key import (SSCD) | NXP Semiconductors Germany GmbH | 2024-06-28 |
| ST31P450 (A07) (ANSSI-CC-2020/04-R02) | STMicroelectronics | 2024-10-21 |
| MIFARE DESFire EV2 on ST31P450 A04 (version 1.0.4) | STMicroelectronics | 2022-12-15 |
| ChipDoc v4.1 on JCOP 4.5 P71 in ICAO EAC(1&2) with PACE configurationVersion 4.1.1.52 (ANSSI-CC-2023/68v2) | NXP Semiconductors | 2026-02-16 |
| Qualcomm Secure Processor Unit SPU290 (Version: 8.0) in SM8750 SoC (Qualcomm® Snapdragon™ 8 Gen 4) with symmetric and asymmetric crypto support | Qualcomm Technologies Inc. | 2025-04-22 |
| Plateforme ID-One Cosmo V9.2 masquée sur le composant IFX SLC52(Identification du matériel : 093772, identification des patchs : 096091 et 096561) (ANSSI-CC-2020/08-R01) | Idemia | 2025-05-09 |
| eTravel 3.2 EAC/BAC on MultiApp V5.2 version 3.2.1.0 (ANSSI-CC-2025/44) | THALES DIS FRANCE SA | 2025-12-16 |
| MTCOS Pro 2.5 EAC with PACE / P71D352 (N7121) | MaskTech International GmbH | 2023-02-22 |
| ACOS-IDv2.1 eMRTD (C) EAC/PACE Configuration Version 2.1 eMRTD (C) (ANSSI-CC-2025/49) | Austria Card plastikkarten und Ausweissysteme Gmbh | 2026-01-20 |
| Huawei BSBC 2.0, version B003 | Huawei Technologies Co., Ltd. | 2022-02-25 |
| PR/SM for IBM z16 and IBM LinuxONE 4 Systems Driver Level 51C with Bundle Level 19B (D51C/B19B) | IBM Corporation | 2024-03-11 |
| ChipDoc v4 on JCOP 4.5 P71 in SSCD configurationVersion 4.0.1.52 (ANSSI-CC-2023/12-R01v2) | NXP Semiconductors Germany GmbH | 2026-02-16 |
| ID-A v1.0 on ID-ONE COSMO X Codes SAAAAR applet : 417692 et 417693 ; Code SAAAR du Common package : 417641 | Idemia / Infineon Technologies AG | 2023-07-04 |
| Samsung STRONG_V2P10_LN04LPE of S5E9925 with Specific IC Dedicated Software revision 1.0 | Samsung Electronics Co. Ltd., | 2024-01-06 |
| IBM RACF for z/OS Version 2 Release 5 | IBM Corporation | 2026-02-09 |
| CombICAO Applet v3 on ID-One Cosmo X (EAC Configuration) SAAAAR : 203742 | Idemia / Infineon Technologies AG | 2023-06-21 |
| AKIS GEZGIN_N v2.0 SAC & EAC Configuration | TÜBİTAK BİLGEM UEKAE | 2024-02-29 |
| ST31G480 D01, including optional cryptographic library NesLib NESLIB and optional technologies MIFARE DESFire EV1 and MIFARE Plus X | STMicroelectronics | 2019-03-05 |
| NXP JCOP 8.x/9.x on SN300 B2 Secure Element, versions JCOP 8.0 R1.38.0.1, JCOP 8.1 R1.06.0.1, JCOP 9.0 R1.07.0.1, JCOP 8.2 R1.06.0.1, JCOP 9.1 R1.07.0.1 | NXP Semiconductors Netherlands N.V. | 2026-01-16 |
| MS6003 embarquant la bibliothèque cryptographique Toolbox version 06.04.01.05 et la bibliothèque Wear Levelling version 06.03.02.02(révision C) (ANSSI-CC-2020/20-R01) | SEALSQ France | 2025-03-30 |
| Plateforme ID-One Cosmo V9.1 masquée sur le composant IFX SLC32 | Idemia | 2020-03-31 |
| CombICAO Applet v3 on ID-One Cosmo X (EAC with PACE Configuration) SAAAAR : 203742 | Idemia / Infineon Technologies AG | 2023-06-21 |
| STMicroelectronics NesLib 6.7.4 on ST33K1M5A and ST33K1M5M B02 | STMicroelectronics | 2024-01-29 |
| NXP JCOP 6.2 on SN220 Secure Element, versions R1.01.1, R1.02.1, R1.02.1-1, R1.02.1-2, R2.01.1, R5.01.1 | NXP Semiconductors Germany GmbH | 2024-06-17 |
| S3FT9MF/S3FT9MT/S3FT9MS(S3FT9MF_20241219) (ANSSI-CC-2024/07-R01) | Samsung Electronics Co. Ltd., | 2025-09-09 |
| NXP eDoc Suite v3.5 on JCOP4 P71 - cryptovision ePasslet Suite – Java Card applet configuration providing Secure Signature Creation Device with Key generation (SSCD) | NXP Semiconductors Germany GmbH | 2024-06-28 |
| HID Global S.p.A. HIDApp-eDoc suite ICAO Application - EAC-PACE-AA Version 3_00 | HID Global S.p.A | 2023-09-05 |
| NXP JCOP 8.x/9.x on SN300 B2 Secure Element, versions JCOP 8.0 R1.38.0.1, JCOP 8.1 R1.06.0.1, JCOP 9.0 R1.07.0.1 | NXP Semiconductors | 2024-11-29 |
| S3D420G/S3D400G/S3D384G/S3D352G/S3D300G/S3K420G , S3D420G_20251231 (EUCC-3090-2026-20) | Samsung Electronics Co. Ltd., | 2026-03-18 |
| P73N2M0B0.2C2/2C6, Version B0.2 | NXP Semiconductors | 2019-12-24 |
| Infineon Technologies Security Controller M9905 A11 with optional ACL v2.07.003 and v2.09.002 | Infineon Technologies AG | 2025-11-04 |
| eTravel Essential 1.1 (PACE, EAC and AA activated) | THALES DIS FRANCE SA | 2022-01-24 |
| Infineon Technologies AG Secure Signature Creation Device with Key generation (SSCD) configuration of SECORA™ ID v2.01 Infineon Applet Collection-eSign V1.0 | Infineon Technologies AG | 2025-07-21 |
| ST33G1M2A1 D01 | STMicroelectronics | 2021-02-18 |
| ST33H768 C01 including optional cryptographic library NesLib and optional technology MIFARE4Mobile | STMicroelectronics | 2020-05-14 |
| CombICAO Applet v2.1 in EAC with PACE configuration for French ID on ID-One Cosmo V9.1 (code SAAAAR : 203523) | Idemia | 2020-07-27 |
| Cryptographic library NESLIB 6.7.4 on ST31N600 A02 (version 6.7.4) ( ANSSI-CC-2022/42-R01) | STMicroelectronics | 2024-06-14 |
| NXP JCOP3 P60 | NXP Semiconductors | 2023-04-25 |
| FM1280 07 Dual Interface Smart Card Chip with IC Dedicated Software 2.77 | Shanghai Fudan Microelectronics Group Co., Ltd. | 2025-10-01 |
| ST33G1M2 (D03) (ANSSI-CC-2020/78-R02) | STMicroelectronics | 2025-08-12 |
| ChipDoc v3.1 on JCOP 4 P71 in SSCD configurationVersion 3.1.6.52 (ANSSI-CC-2021/20-R01v2) | NXP Semiconductors Germany GmbH | 2026-02-16 |
| KOMSCO JK72 V1.0 | KOMSCO | 2024-08-12 |
| NXP SN100 Series - Secure Element with Crypto Library SN100_SE B2.1 C25/C48/C58 | NXP Semiconductors Germany GmbH, Business Unit Security and Connectivity | 2025-02-10 |
| KM67S3B2 Smart Card IC (v1.0) (ANSSI-CC-2024/35) | Nuvoton Technology | 2024-12-06 |
| eTravel 3.1 EAC on BAC on MultiApp V5.1 Version 3.1.0.0 ( ANSSI-CC-2023/35 ) | THALES DIS FRANCE SA | 2023-09-22 |
| IDmove v5 on SCR404U in EAC configuration with AA in optionOS Commercial Version : 0x098912 ; OS Unique Identifier : 0xB7BC0108 et E48C0108 (ANSSI-CC-2023/64) | Idemia | 2024-01-19 |
| ID-One COSMO X (R3 : 093363;R4 : 093364;R4 patché : 093364 + patch 099441) (ANSSI-CC-2021/29v2-R01) | Idemia | 2024-12-18 |
| IAS Classic V4.4 with MOC Server 1.1 on MultiApp V4 | Gemalto - Infineon Technologies AG | 2017-06-16 |
| CENTAURUS_FB_04 (Référence : CENTAURUS_TOE_v4) (ANSSI-CC-2018/51-R02) | THALES DIS FRANCE SA | 2024-07-22 |
| Quantum IAS v1.0.0.A and MOC Server v3.1.1 on MultiApp V5.2 Premium PQCVersions 1.0.0.A (Q-IAS) et 3.1.1 (MOC server) (ANSSI-CC-2026/03) | THALES DIS FRANCE SA | 2026-02-05 |
| CombICAO Applet v3 on ID-One Cosmo X (BAC and CA Configuration) (SAAAAR : 203742) | Idemia / Infineon Technologies AG | 2023-05-05 |
| ST33G1M2A and ST33G1M2M including optional cryptographic library NesLib (C03) (ANSSI-CC-2020/23-R01) | STMicroelectronics | 2024-02-27 |
| IDEMIA TnD v5.1 on ID-One Cosmo X (EAC Configuration) | Idemia | 2023-11-23 |
| eTravel 3.1 EAC on SAC on MultiApp V5.1 Version 3.1.0.0 ( ANSSI-CC-2023/36 ) | THALES DIS FRANCE SA | 2023-09-22 |
| HID Global S.p.A. SOMA-c016 Machine Readable Electronic Document ICAO Application - EAC-PACE-AA, version 4 | HID Global S.p.A | 2023-11-10 |
| ID-One COSMO X Codes SAAAAR : 093363 + patch 099E71 ; 093364 + patchs 099441 et 099E21 ; 093366 | Idemia | 2023-05-23 |
| ChipDoc v3 on JCOP 4 P71 in SSCD configuration (Version 3.0.0.52) (ANSSI-CC-2020/73-R01) | NXP Semiconductors Germany GmbH | 2025-02-12 |
| ACOS-IDv4.1 eMRTD (A) EAC/PACE Configuration (version 4.1 eMRTD (A)) (ANSSI-CC-2025/16) | Austria Card plastikkarten und Ausweissysteme Gmbh | 2025-03-30 |
| TnD v5.1 on ID-One Cosmo J V2 (EAC Configuration) | Idemia | 2022-12-07 |
| NXP eDoc Suite v4.0 on JCOP4.5 P71 - cryptovision ePasslet Suite – Java Card applet configuration providing Secure Signature Creation Device with Key generation (SSCD) | NXP Semiconductors Germany GmbH | 2024-05-03 |
| NXP JCOP-eSE 8.9 R6 on SN330 Secure Element, version JCOP-eSE 8.9 R6.01.00.1.1 | NXP Semiconductors Germany GmbH | 2025-08-25 |
| ID-One ePass IDL Full EACv2 in EAC MRTD configuration on Infineon SLE77CLFX2400P and SLE77CLFX2407P | Oberthur Technologies | 2017-05-11 |
| Veridos Suite v4.0 - cryptovision ePasslet Suite - Java Card applet configuration providing Machine-Readable Electronic Documents „ICAO Application”, Extended Access Control with PACE | Veridos GmbH - Identity Solutions by Giesecke & Devrient and Bundesdruckerei | 2024-01-12 |
| eTravel 2.5.A EAC on BAC on MultiApp V5.0.A (version 2.5.A.0.0) | THALES DIS FRANCE SA | 2022-12-12 |
| MIFARE Plus EV2 on ST31N600 A01 (Version 1.0.2) (ANSSI-CC-2024/03) | STMicroelectronics | 2024-04-15 |
| SOMA-c007 Machine Readable Electronic Document EAC-PACE-AA version 4 (SOMA-c007_4) | HID Global | 2023-09-15 |
| ST33G1M2A1 including optional cryptographic library NesLib and optional library SFM (C04)(ANSSI-CC-2020/24-R01) | STMicroelectronics | 2024-02-27 |
| CombICAO Applet v3 on ID-One Cosmo X (EAC with PACE Configuration) SAAAAR : 203742 (ANSSI-CC-2023/49) | Idemia / Infineon Technologies AG | 2023-11-17 |
| IAS Classic V4.4.2 with MOC server v1.1 | Gemalto | 2018-06-11 |
| Trustonic Kinibi-510a-V007 | TRUSTONIC | 2022-04-07 |
| eTravel 2.5 EAC on BAC on MultiApp V5.0 | THALES DIS FRANCE SA | 2021-11-04 |
| eTravel Essential for Japan 1.0, with SAC (PACE) and AA, embedded in the Infineon SLC52GDA Integrated Circuit(version 0103h) ( ANSSI-CC-2020/87-R01) | THALES DIS FRANCE SA | 2024-03-11 |
| Veridos ePass Applet on Sm@rtCafé Expert 8.0 C1, Version 1.0 | Veridos GmbH - Identity Solutions by Giesecke & Devrient and Bundesdruckerei | 2022-10-31 |
| NXP JCOP 8.9 on SN300 Secure Element JCOP-eSE 8.9 R1.06.00.1.1 | NXP Semiconductors Germany GmbH | 2023-12-14 |
| Cryptographic library NESLIB 6.7.4 on ST31P450 A08 , Version 6.7.4 | STMicroelectronics | 2026-03-26 |
| CombICAO Applet v3 on ID-One Cosmo X (EAC with PACE for French ID Configuration) SAAAAR : 203742 (ANSSI-CC-2023/50) | Idemia / Infineon Technologies AG | 2023-11-17 |
| Cryptographic library NESLIB 6.7.4 on ST31P450 A07 (version 6.7.4) (ANSSI-CC-2022/50-R02) | STMicroelectronics | 2025-07-28 |
| Infineon eID-OSv1.0 eMRTD (A) EAC/PACE Configuration (version 1.0 eMRTD (A)) (ANSSI-CC-2025/24) | Infineon Technologies AG | 2025-06-16 |
| MTCOS Pro 2.5 V2 EAC with PACE / SLE78CLFX400VPHM/BPHM/7PHM (M7892) | MaskTech International GmbH | 2021-08-05 |
| CombICAO Applet v2.1 in EAC configuration on ID-One Cosmo V9.1 (code SAAAAR : 203523) | Idemia | 2020-07-27 |
| Cryptographic library NESLIB 6.11.3 on ST31R480 A01 (version 6.11.3)(ANSSI-CC-2025/26) | STMicroelectronics | 2025-07-10 |
| Samsung S3FV9QM/S3FV9QK 32-bit RISC Microcontroller for Smart Card with optional Secure RSA/ECC/SHA Libraries including specific IC Dedicated Software Référence : S3FV9QM_20200504 | Samsung Electronics Co. Ltd., | 2021-01-15 |
| STRONGV3P10_In04lpe of S5AV920/S5AV820/S5AV720 with specific IC Dedicated Software, version 2.0 and 2.1 | Samsung Electronics Co. Ltd., | 2024-11-12 |
| S3K170A/S3K140A (S3K170A_20231028) ( ANSSI-CC-2024/16) | Samsung Electronics Co. Ltd., | 2024-05-27 |
| MTCOS Pro 2.6 SSCD / P71D352 (N7121) | MaskTech International GmbH | 2023-10-27 |
| ChipDoc v3.1 on JCOP 4 P71 in ICAO EAC (1&2) with PACE configuration (v2) | NXP Semiconductors | 2022-09-28 |
| Cryptographic library NESLIB 6.7.4 on ST31P450 A06 (version 6.7.4) ( ANSSI-CC-2022/50-R01) | STMicroelectronics | 2024-06-14 |
| NXP MF3D(H)x3 | NXP Semiconductors | 2023-03-10 |
| ST33J2M0 including optional cryptographic library NESLIB (F01) (ANSSI-CC-2024/06) | STMicroelectronics | 2024-03-11 |
| Veridos GmbH - Identity Solutions by Gieseke & Devrient and Bundesdruckerei ePass Applet on JCOP 4 C1 | Veridos GmbH - Identity Solutions by Giesecke & Devrient and Bundesdruckerei | 2023-12-20 |
| eTravel v2.3 on MultiApp v4.1 platform, BAC, EAC and AA activated (version 2.3.0.1) (ANSSI-CC-2023/56) | THALES DIS FRANCE SA | 2023-12-14 |
| ST33G1M2A and ST33G1M2M (D02) (ANSSI-CC-2020/79-R01) | STMicroelectronics | 2024-02-27 |
| eTravel Essential 1.3-2.0 – PACE, EAC and AA activated (Version 1.0) | THALES DIS FRANCE SA | 2021-12-27 |
| S3FV9QM/S3FV9QK (S3FV9QM_20230504) | Samsung Electronics Co. Ltd., | 2023-04-11 |
| IAS Classic V4.4 with MOC Server 1.1 on MultiApp V4(IAS version 4.4.0.A / MOC Server 1.1.1A) (ANSSI-CC-2017/22-R01) | THALES DIS FRANCE SA | 2026-02-04 |
| TnD v5.1 on Cosmo J in EAC Configuration | Idemia | 2021-04-22 |
| Plateforme ID-One Cosmo v8.2 masquée sur le composant NXP P60D145 Identification du matériel 091121 | Idemia | 2019-07-19 |
| PR/SM for IBM z15 T02 and IBM LinuxONE III LT2 Systems, Driver Level D41C with Bundle Level H13/S21b | IBM Corporation | 2021-04-21 |
| MK Lotus GovID IMDa in EAC with PACE configuration v4.6.8.8 | MK Smart Joint Stock Company | 2026-01-18 |
| ST31P450 including optional cryptographic library NESLIB (C02) (ANSSI-CC-2023/74-R01) | STMicroelectronics | 2024-10-21 |
| NXP JCOP 7.0 on SN300 Secure Element, JCOP 7.0 R1.62.0.1 | NXP Semiconductors | 2022-10-26 |
| Plateforme ouverte Java Card MultiApp V4.1 en configuration ouverte masquée sur le composant S3FT9MH(Version 4.1.0.2) ( ANSSI-CC-2023/30 ) | THALES DIS FRANCE SA | 2023-12-14 |
| ST54J / ST54K | STMicroelectronics | 2025-03-31 |
| GEOP02 on GSE20 Security Chip, version 1.0 | Shenzhen Goodix Technology Co., Ltd. | 2026-01-18 |
| eTravel Essential 1.2 – BAC, EAC and AA activated (release ‘0300’) | THALES DIS FRANCE SA | 2022-12-12 |
| eTravel v2.3 on MultiApp v4.1 platform, PACE, EAC and AA activated(version 2.3.0.1) ( ANSSI-CC-2023/55 ) | THALES DIS FRANCE SA | 2023-12-14 |
| THN31 Secure Element version 1.0 | Beijing TsingTeng MicroSystem Co.,Ltd. | 2024-01-06 |
| KOMSCO JK62 V1.1 | KOMSCO | 2025-09-30 |
| PikeOS Separation Kernel v5.1.3 for the NXP LS 1023A/LS1043A Processor, Version 3.1.0 | SYSGO GmbH | 2023-09-18 |
| ChipDoc v3.2 on JCOP 4 P71 in SSCD configurationVersion 3.2.0.52 (ANSSI-CC-2025/03v2) | NXP Semiconductors Germany GmbH | 2026-02-16 |
| ST33J2M0(C04) | STMicroelectronics | 2025-01-08 |
| NXP JCOP6.x on SN200.C04 Secure Element | NXP Semiconductors | 2022-09-05 |
| eTravel 2.5 EAC on SAC on MultiApp V5.0 (2.5.0.0) | THALES DIS FRANCE SA | 2021-11-04 |
| ChipDoc v4 on JCOP 4.5 P71 in ICAO EAC with PACE configuration (Version 4.0.1.52) | NXP Semiconductors | 2023-03-01 |
| S3K250A/S3K232A/S3K212A Référence S3K250A_20211028 | Samsung Electronics Co. Ltd., | 2022-01-24 |
| HID Global S.p.A. SOMA-c016 Machine Readable Electronic Document eIDAS QSCD Application, version 4 | HID Global S.p.A | 2023-11-10 |
| ACOS-IDv4.1 SSCD (A) CL-TC-Comm (version 4.1 SSCD (A)) (ANSSI-CC-2025/18) | Austria Card plastikkarten und Ausweissysteme Gmbh | 2025-03-30 |
| NXP JCOP 8.x on SE310 A0 Secure Element, versions JCOP 8.0 R1.38.0.1, JCOP 8.1 R1.06.0.1 and JCOP 8.2 R1.06.0.1 | NXP Semiconductors Netherlands N.V. | 2026-01-16 |